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American English

Published by Pearson (September 18, 2014) © 2015

Chang Liu
    VitalSource eTextbook (6 months access)
    €28,99
    ISBN-13: 9781292013985R180

    Foundation of MEMA ,2nd edition

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    Language: American English

    Product Information

    Preface to Second Edition
    Preface to First Edition
    Note to Instructors
    About the Author
    Notational Conventions

    Chapter 1: Introduction
    1.0. Preview    
    1.1.  The History of MEMS Development    
    1.1.1. From the Beginning to 1990    
    1.1.2. From 1990 to 2001    
    1.1.3. 2002 to present    
    1.1.4. Future Trends    
    1.2. The Intrinsic Characteristics of MEMS    
    1.2.1. Miniaturization    
    1.2.2. Microelectronics Integration    
    1.2.3. Parallel Fabrication with Precision    
    1.3. Devices: Sensors and Actuators         
    1.3.1. Energy Domains and Transducers         
    1.3.2. Sensors Considerations         
    13.3.  Sensor Noise and Design Complexity         
    1.3.4. Actuators Considerations         
    Summary   
    Problems 
    References 

    Chapter 2: First-Pass Introduction to Microfabrication           
    2.0. Preview         
    2.1. Overview of Microfabrication         
    2.2. Essential Overview of Frequently Used Microfabrication Processes    
    2.2.1. Photolithography         
    2.2.2. Thin film deposition         
    2.2.3. Thermal oxidation of silicon         
    2.2.4. Wet Etching         
    2.2.5. Silicon anisotropic etching         
    2.2.6. Plasma etching and reactive ion etching         
    2.2.7. Doping         
    2.2.8. Wafer dicing         
    2.2.9. Wafer bonding         
    2.3. The Microelectronics Fabrication Process Flow         
    2.4. Silicon-based MEMS Processes         
    2.5. Packaging and Integration         
    2.5.1. Integration Options         
    2.5.2. Encapsulation         
    2.6. New Materials and Fabrication Processes         
    2.7. Process Selection and Design         
    2.7.1. Points of Consideration for Deposition Processes    
    2.7.2. Points of Consideration for Etching Processes         
    2.7.3. Ideal Rules for Building a Process Flow         
    2.7.4. Rules for Building a Robust Process         
    Summary         
    Problems         
    References         

    Chapter 3: Review of Essential Electrical and Mechanical Concepts         
    3.0 Preview         
    3.1. Conductivity of Semiconductors         
    3.1.1. Semiconductor Materials         
    3.1.2. Calculation of Charge Carrier Concentr

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