Published by Pearson (September 18, 2014) © 2015
Chang LiuPreface to Second Edition
Preface to First Edition
Note to Instructors
About the Author
Notational Conventions
Chapter 1: Introduction
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1.1. The History of MEMS Development
1.1.1. From the Beginning to 1990
1.1.2. From 1990 to 2001
1.1.3. 2002 to present
1.1.4. Future Trends
1.2. The Intrinsic Characteristics of MEMS
1.2.1. Miniaturization
1.2.2. Microelectronics Integration
1.2.3. Parallel Fabrication with Precision
1.3. Devices: Sensors and Actuators
1.3.1. Energy Domains and Transducers
1.3.2. Sensors Considerations
13.3. Sensor Noise and Design Complexity
1.3.4. Actuators Considerations
Summary
Problems
References
Chapter 2: First-Pass Introduction to Microfabrication
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2.1. Overview of Microfabrication
2.2. Essential Overview of Frequently Used Microfabrication Processes
2.2.1. Photolithography
2.2.2. Thin film deposition
2.2.3. Thermal oxidation of silicon
2.2.4. Wet Etching
2.2.5. Silicon anisotropic etching
2.2.6. Plasma etching and reactive ion etching
2.2.7. Doping
2.2.8. Wafer dicing
2.2.9. Wafer bonding
2.3. The Microelectronics Fabrication Process Flow
2.4. Silicon-based MEMS Processes
2.5. Packaging and Integration
2.5.1. Integration Options
2.5.2. Encapsulation
2.6. New Materials and Fabrication Processes
2.7. Process Selection and Design
2.7.1. Points of Consideration for Deposition Processes
2.7.2. Points of Consideration for Etching Processes
2.7.3. Ideal Rules for Building a Process Flow
2.7.4. Rules for Building a Robust Process
Summary
Problems
References
Chapter 3: Review of Essential Electrical and Mechanical Concepts
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3.1. Conductivity of Semiconductors
3.1.1. Semiconductor Materials
3.1.2. Calculation of Charge Carrier Concentr